In-situ measurements of Stress during electrodeposition of copper nanofilms: Effect of growth rate and additives

Joe A. Murphy, Catherine Lenihan, Maria Rybalchenko, Nathan Quill, Andrea Bourke, Michael O'Grady, Robert P. Lynch, D. Noel Buckley

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    1 Citation (Scopus)

    Abstract

    Stress was measured in situ during electrodeposition of copper nanofilms. Grain size was measured using both in-situ AFM and exsitu SEM imaging and showed that grain size increased with time for about the first 10 depositions and thereafter became approximately constant. Films deposited at low growth rates had compressive stress while films deposited at higher growth rates had tensile stress. The transition from compressive to tensile stress occurred at a growth rate of-1 nm s-1, in reasonable agreement with the literature. Our data supports Chason's model for stress development during thin film deposition. Addition of chloride gives decreased stress, a rougher surface and larger grains. Addition of PEG alone has very little effect on the stress in the deposit. The reduction in stress due to chloride is still observed when PEG is also added and this greatly reduces the surface roughness which occurs with the addition of chloride alone.

    Original languageEnglish
    Title of host publicationECS Transactions
    PublisherElectrochemical Society, Inc.
    Pages1071-1086
    Number of pages16
    Edition13
    ISBN (Electronic)9781607688419
    ISBN (Print)9781510866171
    DOIs
    Publication statusPublished - 2018
    Event233rd Meeting of the Electrochemical Society - Seattle, United States
    Duration: 13 May 201817 May 2018

    Publication series

    NameECS Transactions
    Number13
    Volume85
    ISSN (Print)1938-6737
    ISSN (Electronic)1938-5862

    Conference

    Conference233rd Meeting of the Electrochemical Society
    Country/TerritoryUnited States
    CitySeattle
    Period13/05/201817/05/2018

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